Item
|
Aluminum Production
Capability
|
Base Material
|
Aluminum
|
Layers
|
1-2
|
Finised inner/outer copper thickness
|
1-2OZ
|
Finished board thickness
|
0.2-3.0mm
|
Thermal Conductivity
|
0.5/1/1.5/2W/m.K
|
Minimum Size
|
1500mm 1Layer
|
Controlled Impedance
|
+/-5%
|
Outline profile
|
Rout/ V-cut/ Bridge/ Stamp hole
|
Surface treatment
|
HASL, HASL lead free, Immersion Gold, Immersion Tin, Immersion Silver, Hard gold, Flash gold, OSP…
|
Specification of alumimum substrate plate:1W/m.k
|
|
|
|
|
item
|
Test Method
|
Units
|
Index
|
|
Insulation thickness
|
IPC-TM-650 2.2 18.1
|
PM
|
100
|
|
Thermal Stress
|
IPC-TM-650 2.4 13.1
|
S
|
288℃>120S
|
|
Peel Strength
|
IPC-TM-650 2.4 8.1
|
N/mm
|
1.5
|
|
Withstand voltage
|
DC
|
KV
|
Grinding plate:1.2 Oxidation:1.5
|
|
Break-down Voltage
|
AC
|
KV
|
3
|
|
CTI
|
GB/T 4207
|
V
|
575
|
|
Glass Transition Temperature
|
IPC-TM-650 2.4 25
|
℃
|
130
|
|
CTE(TMA)
|
IPC-TM-650 2.4 24
|
%(50-260℃)
|
0.5
|
|
Surface Resistance
|
IPC-TM-650 2.6 17.1
|
MQ
|
4.18×103
|
|
Volume Resistance
|
IPC-TM-650 2.6 17.1
|
MQcm
|
3.27×107
|
|
Dielectric Constant 1 MHZ
|
IPC-TM-650 2.6 5.9
|
/
|
/
|
|
Dissipation Factor 1 MHZ
|
IPC-TM-650 2.6 5.9
|
/
|
/
|
|
Water Absorption
|
IPC-TM-650 2.6 2.1
|
%
|
<0.5
|
|
Thermal Conductivity
|
ASTM E 1464
|
W/m-k
|
1.3
|
|
Heat Resistance
|
/
|
℃/W
|
0.7-0.9
|
|
Flammability
|
UL 94 Vertical Law
|
S
|
t1:0,t2:0
|