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BOSTIK THERMELT 858 Hot Melt Glue for LPMS Low Pressure Molding
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US$ 12
≥1 Kilograms
Quick Details
CAS No.:
63428-83-1
Place of Origin:
France
Brand Name:
BOSTIK
Model Number:
THERMELT 858 Black
Product Details
Products Features
Bostik Thermelt 858 Black
Moldable polyamide with very good thermal stability as well as UV and moisture resistance. Available in black only.
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1. Limit temperatures for use
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-40/+125 [°C]
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2. Application temperature
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210/230[°C]
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3. Softening point
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180 [°C]
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4. Brookfield viscosity
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4.4, At 220 [°C], Adjustable
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5.Yield strength
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4.4 [Mpa]
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6. Elongation at break
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340 [%]
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7. Shore hardness(instant)
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Shore D 49
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8. Glass transition temperature
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-30 [°C]
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9.Moisture absorption (immersed 14 days)
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1.9 [%]
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10. UL 94 flammability test
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V0
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Electrical properties
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1. Transversal resistivity (500V)
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1.4*10^12 [Ω.cm]
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2. Dielectric rigidity (23°C)
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20 [kV/mm]
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3. Relative permitivity (23°C)
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5.6 Hz
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Thermal properties
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HDT B [°C]
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43 [°C]
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Vicat A120 [°C]
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77 [°C]
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Thermal conductivity @23°C
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~0.2 [W/m.°K]
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Thermal conductivity @180°C
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~0.6[W/m.°K]
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α coefficient of linear expansion
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200-300 [ppm/°K]
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Product Name
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Operating Range
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Application Temperature
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Shore Hardness ( ISO 868 )
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Softening Point ( ASTMD3461 )
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Thermelt 861
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-40°C to 125°C
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190 ~ 210°C
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38D
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160°C±5°C
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Thermelt 867
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-40°C to 150°C
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200 ~ 220°C
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45D
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183°C±5°C
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Thermelt 866
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-25°C to 115°C
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180 ~ 210°C
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30D
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155°C±5°C
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Thermelt 817 R
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-15°C to 125°C
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180 ~ 210°C
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49D
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170°C±5°C
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Thermelt 868
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-40°C to 150°C
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190 ~ 210°C
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39D
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160°C±5°C
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Thermelt 858
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-40°C to 150°C
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210 ~ 230°C
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49D
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180°C±5°C
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Thermelt 865
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-55°C to 120°C
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190 ~ 210°C
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31D
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157°C±5°C
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Thermelt 892
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-20°C to 140°C
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200 ~ 230°C
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53D
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173°C±5°C
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Thermelt 195
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-20°C to 150°C
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210 ~ 230°C
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56D
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200°C±5°C
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Thermelt 861 HV
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-40°C to 125°C
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210 ~ 230°C
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22D
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160°C±5°C
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Thermelt 867 HV
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-40°C to 150°C
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210 ~ 230°C
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32D
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182°C±5°C
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