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Polyamide Hot Melt Adhesive Glue for low pressure molding for BOSTIK THERMELT
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US$ 12
≥20 Kilograms
Quick Details
CAS No.:
63428-83-1
Place of Origin:
France
Brand Name:
BOSTIK
Model Number:
THERMELT 870 AS
Product Details
Products Features
|
1. Limit temperatures for use
|
-40/+125 [°C]
|
|
2. Application temperature
|
190/210[°C]
|
|
3. Softening point
|
154-166 [°C]
|
|
4. Brookfield viscosity
|
4.2, At 200 [°C]
|
|
5.Yield strength
|
4.0 [Mpa]
|
|
6. Elongation at break
|
360 [%]
|
|
7. Shore hardness(instant)
|
Shore D 39
|
|
8. Glass transition temperature
|
-30 [°C]
|
|
9.Moisture absorption (immersed 14 days)
|
2.8 [%]
|
|
10. UL 94 flammability test
|
V0
|
|
Electrical properties
|
|
|
1. Transversal resistivity (500V)
|
1*10^12[Ω.cm]
|
|
2. Dielectric rigidity (23°C)
|
20 [kV/mm]
|
|
3. Relative permitivity (23°C)
|
5.6 Hz
|
|
Thermal properties
|
|
|
HDT B [°C]
|
-
|
|
Vicat A120 [°C]
|
-
|
|
Thermal conductivity @23°C
|
~0.2 [W/m.°K]
|
|
Thermal conductivity @180°C
|
~0.6[W/m.°K]
|
|
α coefficient of linear expansion
|
200-300 [ppm/°K]
|
|
Product Name
|
Operating Range
|
Application Temperature
|
Shore Hardness ( ISO 868 )
|
Softening Point ( ASTMD3461 )
|
|
Thermelt 861
|
-40°C to 125°C
|
190 ~ 210°C
|
38D
|
160°C±5°C
|
|
Thermelt 867
|
-40°C to 150°C
|
200 ~ 220°C
|
45D
|
183°C±5°C
|
|
Thermelt 866
|
-25°C to 115°C
|
180 ~ 210°C
|
30D
|
155°C±5°C
|
|
Thermelt 817 R
|
-15°C to 125°C
|
180 ~ 210°C
|
49D
|
170°C±5°C
|
|
Thermelt 868
|
-40°C to 150°C
|
190 ~ 210°C
|
39D
|
160°C±5°C
|
|
Thermelt 858
|
-40°C to 150°C
|
210 ~ 230°C
|
49D
|
180°C±5°C
|
|
Thermelt 865
|
-55°C to 120°C
|
190 ~ 210°C
|
31D
|
157°C±5°C
|
|
Thermelt 892
|
-20°C to 140°C
|
200 ~ 230°C
|
53D
|
173°C±5°C
|
|
Thermelt 195
|
-20°C to 150°C
|
210 ~ 230°C
|
56D
|
200°C±5°C
|
|
Thermelt 861 HV
|
-40°C to 125°C
|
210 ~ 230°C
|
22D
|
160°C±5°C
|
|
Thermelt 867 HV
|
-40°C to 150°C
|
210 ~ 230°C
|
32D
|
182°C±5°C
|
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