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PCB Technical Specification
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Order quantity
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1-500,000
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Number of layer
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1,2,4,6,up to 22 layers
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Board material
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FR-4, glass epoxy, FR4 High Tg, Rohs compliant, Aluminum, Rogers, etc
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PCB type
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Hard, flexible, rigid-flexible
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Shape
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Any shape: Rectangular,round,slots,cutouts,complex,irregular, etc
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Max PCB dimensions
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20inch*20inch or 500mm*500mm
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Board thickness
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0.4~4.0mm
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Thickness tolerance
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± 10%
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Copper thickness
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1/2OZ 1OZ 2OZ 3OZ
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Copper thickness tolerance
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± 0.25oz
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Solder mask
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Green, red, white, yellow, blue, black, etc
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Silk screen
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White, yellow, black, or negative, etc
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Silk screen min line width
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0.006'' or 0.15mm
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Surface finish
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HASL, Nickle, Imm Gold, Imm Tin, Imm Silver, OSP etc
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Min drill hole diameter
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0.01'',0.25mm.or 10 mil
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PCB cutting
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Shear,V-score,tab-routed
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PCB Assembly Capabilities
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SMT Jointing Min. Space
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0201mm
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QFP Space
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Pitch 0.3mm
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Min. Package
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201
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Min. Size
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2*2 inch(50*50mm)
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Max. Size
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14*22 inch(350*550mm)
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Placement Precision
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±0.01mm
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Placement Precision
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QFP, SOP, PLCC, BGA
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Placement Capability
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0805, 0603, 0402, 0201
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PCB Lead time (workday(s))
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Single, Double-sided
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4 layer
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6 layer
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Over 8 layer
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HDI
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Sample Lead time (Normal)
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4~5 days
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6~7 days
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7~8 days
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10~12 days
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10~12 days
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Sample Lead time (Faster)
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2~3 days
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3~5 days
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6 days
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6~7 days
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12 days
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Mass production lead time
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7~10 days
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10~14 days
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13-14 days
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16 days
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20 days
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PCB Assembly Lead time
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Sample Lead time
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PCB Fab+Components Sourcing+PCBA= 7~15 days according to level difficulties.
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Mass production lead time
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PCB Fab+Components Sourcing+PCBA=14~28 daysaccording to QTY and level difficulties.
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