Device model
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SY-JM9-1
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Equipment size
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1700mmH x 1200mmW x 1300mmL
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The scope of work
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X:500mm Y:500mm Z:50mm
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CCD image
|
20 million pixel industrial camera
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Repeat accuracy
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±0.02mm
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Productivity
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300mm/s
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equipment weight
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500KG
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Product Size
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500mm*500mm
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PCB thickness
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0.5~5mm
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Spraying diameter
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>Ø0.4mm
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operating system
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Windws
|
Targeting
|
MARK optical ositioning MARK optical ositioning
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transfer method
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Servo motor + ball screw + linear slide (X/Y/Z)
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Applicable glue
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Surface mount glue, conductive silver paste, IC packaging glue, underfill glue, sealant, surface coating glue, etc.
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Glue viscosity
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0-30000PCS
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working pressure
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6.0(±0.5)KG/CM²
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Operating Voltage
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AC220V 50HZ
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working environment
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0℃~ 40℃ Optional heating range 20℃~ 80℃
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Operating power
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2.0KW
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Linear Guides
|
THK (Japan) THK (Japan)
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Ball screw rod
|
Kuroda (Japan)
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Drive System
|
Fuji electric (Japan)
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Pneumatic Components
|
SMC (Japan)SMC (Japan)
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Sensor device
|
Omron (Japan)
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Dispensing space
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>100mm
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Glue precision
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0.01 mm mg
|