Model
|
Color
|
Curing Speed (25℃)
|
|
Viscosity
(mPa•S) |
Filling gap
(mm) |
Shear strength (MPa)
|
Working temperature (℃)
|
|
|
|
Position
|
Fully cured
|
|
|
|
|
|
HY401
|
transparent
|
20s
|
18h
|
30~100
|
≤0.10
|
≥10
|
-60~90
|
|
HY406
|
transparent
|
15s
|
18h
|
5~40
|
≤0.10
|
≥10
|
-60~90
|
|
HY460
|
transparent
|
40s
|
18h
|
100~300
|
≤0.15
|
≥10
|
-60~90
|
|
HY495
|
transparent
|
20s
|
18h
|
50~150
|
≤0.15
|
≥10
|
-60~90
|
|
HY496
|
transparent
|
40s
|
18h
|
80~200
|
≤0.15
|
≥10
|
-60~90
|
Product Model
|
Product Features and Applications
|
HY401
|
General purpose, medium viscosity, used for inert surfaces, bonding acidic, porous and absorbent materials.
|
HY406
|
Low viscosity, used for bonding rubber, plastic and other materials.
|
HY460
|
Low whitening, used for bonding electronic components with low whitening requirements.
|
HY495
|
General purpose, low to medium viscosity. Used for bonding rubber, metal and plastic parts.
|
HY496
|
Medium viscosity. Used for bonding metal and other materials.
|