Polyurethane Reactive Hot Melt Adhesive (PUR), is the moisture cured reactive polyurethane hot melt adhesive. The basis is end isocyanic acid polyurethane. Under the high temperature condition, PUR adhesive molecule react with the moisture in the air or on the adherend, or react with the live hydrogen matters to form portion cross-linked network structure, which makes the bonding strength, heat resistance, water resistance, chemical resistance better than other normal adhesives.
Jcc 5125 is no-solvent moisture curing reactive pur hotmelt adhesive glue for WPC / PVC / SPC flooring lamination, bonding SPC/PVC with corkwood board, WPC floor, SPC board with PVC film or silence pad mute mat.
With advantages of 100% solid content, initial high bonding strength, fast curing speed only 12hours to be cut into certain dimentions, continuously fast production efficiency.
With excellent heat resistant, -60°C to more than 150°C, opeartioan temperature about 130 to 150°C, high peeling strength to be cutted into certain dimensions, suitabel for cutting into ruts and non-sticking.
Model no |
5110 |
5140 |
5120 |
5104 |
5210 |
|
chemical content |
polyurethane |
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solid content |
100% |
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viscosity(mPas) |
120℃ |
10000±2000 |
55000±10000 |
25000±5000 |
30000±5000 |
10000±2000 |
130℃ |
6000~9000 |
40000±5000 |
20000±5000 |
20000±5000 |
6000~9000 |
|
operation temperature: |
120-140℃ |
140~160℃ |
130-150℃ |
120-140℃ |
120-140℃ |
|
open time: |
10min |
20~50s |
1-3min |
1-2min |
40~70s |
|
curing time: |
2-5days |
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application area |
WPC,SPC floor bonding; chair rail compounding |
veneer&door frame line lamination;aluminum profile compounding |
aluminum board&PVC bonding; chair rail bonding |
SPC floor and silence pad bonding |
autos back shroud bonding |