UNIPOL-1202 machine is equipped with 12" super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 4" in diameter . It can be used as a standard grinding and polishing machine for preparing metallographic samples as well.
SPECIFICATIONS
Power |
AC 208-240V (50/60Hz)
|
Features |
· One cast-iron plate for lapping and one cast aluminum plate for polishing · Two rocking workstations with wafer holders and condition rings, which can be controlled independently for polishing 2 pcs of 4" wafers at the same time · Complete accessories are included for immediate use |
Super-Flat 12" (300 mm) Diameter Lapping Plate |
Flatness < 0.25 micron / inch² |
Precision Rotating Plate Run-off |
< 5 micron |
Heavy Duty Cast Aluminum Case with Bright Painting |
Color: Black or White |
Two Work Stations with 8° Rocking and adjustable speed |
8" rocking with 0- 9 rocking/minute adjustable |
Flat Sample Holders |
Two Flat Holders: 105 Dia. x 35 T mm, which can carry 2 samples up to 4" diameter |
Condition Rings |
Two condition rings: 120 O.D. x 110 I.D. x 32 T mm, which ensures the polished surface flat |
Variable Speed of Master Plate with Digital Display |
0 ~ 125 rpm |
Adjustable Timer for Auto-Stop |
0 - 99 hours |
Motor |
300 W high torque DC motor |
Dimensions |
700 L x 475 W x 300 H (mm) |
Weight |
154 lbs |
Optional Automatic Slurry Feeder |
Automatic slurry feeder SKZD-2
is optional, please click the 1st picture to order at an extra cost
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Dimensions of shipment |
40" x 30" x 26" |
Weight of shipment |
245 lbs |
Compliance |
· CE Certified |
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· One year limited with lifetime support · Rusting and damage due to improper storage condition or maintenance is not covered by warranty |