King Field has established long-term and stable cooperate relations with the world's leading communication equipment , aerospace electronics and medical equipment manufacturers.
SMT Manufacturing Capability
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Item
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Manufacturing Capability in process
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Manufacturing Method
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Production size(Min/Max)
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50×50mm / 500×500mm
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Production board thickness
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0.2 ~ 4mm
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Printing solder paste
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Support method
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Magnetism fixture, vacuo platform
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Sticking up by vacuo, clamping on both sides ,flexible clamping with sheet, flexible clamping with thick board
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Cleaning Method of printing solder paste
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Dry method+ wetting method+ Vacuo method
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Accuracy of printing
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±0.025mm
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SPI
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Repeated accuracy of volume
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<1% at 3σ
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Mounting component
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Components size
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0603(Option) L75mm Connector
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Pitch
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0.15mm
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Repeated accuracy
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±0.01mm
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AOI
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FOV size
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61×45mm
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Test speed
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9150mm²/Sec
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3D X-ray
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Shootingangle
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0-45
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