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Thermal Putty 2.6 W Silicone Insulating Thermal Grease Low Thermal Resistance Thermal Conductive Paste for LED
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US$ 32.5
≥2 Kilograms
US$ 31.5
≥3 Kilograms
Quick Details
CAS No.:
N/A
Other Names:
Cooling Thermal Paste
MF:
MIXTURE
EINECS No.:
N/A
Product Details
Product Description
Silicone insulating thermal grease is made of silicone oil as matrix and filled with various high-performance ceramic composite powders. The viscosity of this product is low, which can make close contact between the surface of the electronic components to be cooled and the heat sink, reduce thermal resistance, and can quickly and effectively reduce the temperature of electronic components, thereby extending the service life of electronic components and improving their reliability. In addition to insulation and low thermal resistance, this product does not generate stress during use and has a very small interface thickness. It has high stability at -60 to 200℃, and has excellent weather resistance and radiation resistance.
Properties
●Low sedimentation＆ low thermal resistance
●Low oil separation
●Good interface wetting performance
●Excellent chemical and mechanical stability
●Good interface wetting performance
●Excellent chemical and mechanical stability
Applications
●The power or the power supply module
● Mainframe and small office networking equipment
● LED assembly
●Automotive electronics
● Mainframe and small office networking equipment
● LED assembly
●Automotive electronics
Directions for use
● Surfaces in contact with thermal grease must be clean and dry;
● Apply a thin layer of thermal silicone grease evenly on the plane of the electronic device or radiator;
● The plane of the electronic device and the radiator is pressed so that the thermal grease forms a very thin interface between the two planes;
● Harden the heat sink
Specification
|
Typical performance
|
Uest method
|
Unit
|
CR TM SGrease-1260
|
CR TM SGrease-1310
|
|
|
Color
|
visual
|
/
|
white
|
white
|
|
|
Viscosity@23℃/93#spindle＆10RPM
|
ASTM D2196
|
CPS
|
60000
|
200000
|
|
|
Density, ± 0.2
|
ASTM D1475
|
g /cm³
|
3.2
|
3.3
|
|
|
Thermal conductivity
|
ASTM D5470
|
W/(M · K)
|
2.6
|
3.1
|
|
|
Thermal resistance@80℃/40psi
|
ASTM D5470
|
℃-c㎡/W
|
0.11
|
0.10
|
|
|
BLT@80℃/40psi
|
Jinghe lab
|
µm
|
30
|
20
|
|
|
Dielectric srength@23℃,Min.
|
ASTM D149
|
KV/mm
|
5.0
|
5.0
|
|
|
Dielectric constant@50Hz
|
ASTM D150
|
/
|
5.2
|
5.5
|
|
|
Volume resistivity,Min.
|
ASTM D1169
|
Ohm-cm
|
1*10
12
|
1*10
12
|
|
|
Volatile content@200℃＆24h,Max.
|
HG/T 2502-1993 5201
|
%
|
1
|
1
|
|
|
Oil separation@200℃＆24h,Max.
|
HG/T 2502-1993 5201
|
#
|
0.05
|
0.05
|
|
|
Copper mirror corrosion@23℃＆50RH/24h
|
HG/T 2502-1993 5201
|
/
|
No corrosion of copper film
|
|
|
|
Shelf life @≤23℃
|
/
|
months
|
12
|
12
|
|
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