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Two-Component Shockproof Waterproof Electronic Insulation Led Driver Thermal Conductive Silicone Potting Compound AB Glue
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US$ 3.5
≥1 Kilograms
Quick Details
CAS No.:
7085-85-0
Other Names:
Silicone Sealant
EINECS No.:
230-391-5
Place of Origin:
Guangdong, China
Product Details
Technical Parameter
|
No.
|
|
Test item
|
Unit
|
Product test results
|
|
||
|
|
|
|
|
Component A
|
Component B
|
||
|
Before curing
|
1
|
Exterior
|
---
|
white fluid
|
grey fluid
|
||
|
|
2
|
Viscosity
|
25ºC，mPa·S
|
4500~5000
|
4500~5000
|
||
|
|
3
|
density
|
25ºC，g/cm3
|
1.50±0.05
|
1.50±0.05
|
||
|
|
4
|
The mixing ratio
(A:B) |
weight ratio
|
100
|
100
|
||
|
|
|
|
Volume ratio
|
100
|
100
|
||
|
|
5
|
Operation time
|
hr
|
0.3-0.4
|
|
||
|
|
6
|
curing conditions
|
hr
|
4~12 （25ºC，Preliminary curing）
|
|
||
|
|
|
|
|
0.20 （80ºC）
|
|
||
|
After curing
|
7
|
Appearance
|
---
|
grey elastomer
|
|
||
|
|
8
|
Hardness
|
Shore A
|
50±5
|
|
||
|
|
9
|
Coefficient of Thermal Conductivity
|
w/m·k
|
≥0.76
|
|
||
|
|
10
|
Expansion Coefficient
|
µm/(m,ºC)
|
210
|
|
||
|
|
11
|
Bibulous Rate
|
24h,25ºC,%
|
0.01~0.02
|
|
||
|
|
12
|
Resistivity of Volume
|
（DC500V）,Ω· cm
|
1.0×1016
|
|
||
|
|
13
|
Dielectric Strength
|
Kv/mm(25ºC)
|
18~25
|
|
||
|
|
14
|
Temperature Resistance
|
ºC
|
-50~+250
|
|
||
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