Type of Assembly
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SMT and DIP assembly
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Foot Pin
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SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
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Solder Type
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Water Soluble Solder, Lead-Free, Wave soldering
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Components
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Passive Down to 0201 size
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BGA and VFBGA
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Leadless Chip Carriers/CSP/QFN
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Double-sided SMT Assembly
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Fine Pitch to 0.8mils
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BGA Repair and Reball
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Part Removal and Replacement
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PCB assembly process
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Components purchasing
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IQC materials inspection
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Components and solder paste stock
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SMT assemly ---AOI inspection 100%---X-ray inspection for BGA
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Boards moving by transporting cart to avoid damage or polluting
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DIP assembly ----Function testing if needed
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Reliability Testing (burn-testing) - Package - Shipping
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Package
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Anti-static Bubble Bag & Carton
pcb broad assembly
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