Company Capability
|
|
|
Layers
|
1-40 layers
|
|
Copper Thickness
|
0.5-6 OZ
|
|
Material
|
FR4 ( Shengyi China, ITEQ, KB A+,HZ),HI-TG, FR06, Rogers, Taconic, Argon, Nalco, Isola and so on
|
|
Solder Mask
|
green, yellow,white, blue,black,red
|
|
Finished Surface
|
conventional hasl, lead free hasl, immersion gold, immersion tin,immersion silver, hard gold, OSP...
|
|
Silkscreen color
|
white,black
|
|
Products Type
|
HF (High-Frequency) &(Radio Frenquency ) board, impendance controlled board, HDI board, BGA & Fine pitch board
|
|
Minimum line width/gap
|
3.5/4mil(laser drill)
|
|
Minimum hole size
|
0.15mm (mechanical drill) /4mil(laser drill)
|
|
Minimum Annlar Ring
|
4mil
|
|
Max Copper thickness
|
6OZ
|
|
Min Solder Mask Bridge
|
0.08mm
|
|
Plugging Vias capability
|
0.2-0.8mm
|