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Newspectrum Hydroponic Indoor Plant Grow Chip LED COB With Solderless Connector Full Spectrum Chip LED 50W

Get Latest Price

US$ 0.86

≥2 Sets

Quick Details

Warranty(Year):

2-Year

Support Dimmer:

Yes

Luminous Efficacy(lm/w):

100

Color Rendering Index(Ra):

Color Temperature(CCT):

1400K-6500K

Input Voltage(V):

AC 220-240V

Product Weight（kg）:

0.03

Luminous Intensity:

Luminous Flux(lm):

5000

Optical Attenuation(%):

Power Dissipation:

0, 0.01

Viewing Angle(°):

120

Color Temperature:

3000-6500K

Operating Temperature(℃):

-20 - 60

Storage Temperature(℃):

-20 - 60

Place of Origin:

Guangdong, China

Brand Name:

Newspectrum

Product name:

220V COB LED Chip

Application:

Spotlights/grow light/foold light

Voltage:

AC 220V

EMIT SIZE:

25*25mm

Size:

54*54mm

Customized:

color/brightness/logo

Net Weight:

14g

Certification:

CE,RoHS

PF:

0.9

Product Details

Newspectrum Hydroponic Indoor Plant Grow Chip LED COB With Solderless Connector Full Spectrum Chip LED 50W

Features

① :LED flip chip assembly technology. Good heat dissipation effect, higher light output rate, long life ②: High brightness, our led chips are bigger than others ③: Smart IC Fit NO Driver

④: Constant current and constant power control

⑤: NTC sensor for pcb overheat protection

⑥: Voltage-regulator for ic vdd protectio

⑦: Driver IC, over voltage and over current control

⑧: It can use led dimmer or SCR dimmer to dimming it

⑨: MOV for surge protection>4000V passed ⑩: 1000V Bridge rectifier

Specification

Power	20W	30W	50W
Voltage	AC220-240V(50Hz/60Hz)	AC220-240V(50Hz/60Hz)	AC220-240V(50Hz/60Hz)
Color	Cool/Warm White/Others	Cool/Warm White/Others	Cool/Warm White/Others
CRI （Ra）	70-80	70-80	70-80
CCT	1400-6500K	1400-6500K	1400-6500K
Luminous Flux	80 lm/W	80 lm/W	80 lm/W
Board Size	54mm*54mm	54mm*54mm	54mm*54mm
Luminous Size	25mm*25mm	25mm*25mm	25mm*25mm
Hole Distance	30mm*30mm	30mm*30mm	30mm*30mm
Working Temperatur	-20℃~60℃
Customized	Color/Brightness/Logo/Others
Application	Spotlights/Grow light/Foold light

Flip Chip

A1:No lead connection required

A2: No line shading, higher light output rate

A3: Direct bonding, good heat dissipation effect

A4: Suitable for high-power light sources

A5: Longer life

Wire Bonding Chip

A1 :Need lead connection

A2 :The front electrode blocks light, and the light output rate is low
A3 :Insulating glue solid crystal, low heat dissipation efficiency
A4 :Only suitable for small current
A5 :Wired occupies volume, small space