Product parameter
|
|
|
|
|
||||
|
* Intel® Xeon® processor E5-2600 v3, Intel® Xeon® processor E5-2600 v4
* Dual Socket LGA-2011-3 (Socket R3) supported, CPU TDP support Up to 145W TDP, 1 QPI up to 9.6 GT/s |
|
|
|
||||
Chipset
|
* Intel® C612
|
|
|
|
||||
Memory
|
* 8 DIMM slots, Up to * 512GB Registered ECC RDIMM, DDR4-2400MHzUp to 1TB 3DS ECC LRDIMM
|
|
|
|
||||
On-Board Devices
|
* SATA3 (6Gbps); RAID 0/1/5/10 support
|
|
|
|
||||
Drive Bays / Storage
|
* 8x 3.5"/2.5" hot-swap SATA/SAS drive bays + Rear optional(2x 2.5")
|
|
|
|
||||
Network
|
* 2x 1GbE BaseT with Intel® i210,1x RJ45 IPMI
|
|
|
|
||||
IPMI
|
* IPMI 2.0
|
|
|
|
||||
Video
|
* 1 VGA port(s)
|
|
|
|
||||
Expansion Slots
|
* 3 PCI-E 3.0 x8,
* 1 PCI-E 3.0 x16, * 1 PCI-E 3.0 x4 (in x8 slot) * 1 PCI-E 2.0 x4 (in x8 slot) |
|
|
|
||||
Power Supply
|
* 550~2000W Redundant Platinum Level power supplies
|
|
|
|
||||
Dimension
|
650*438*88mm(D*W*H)
|
|
|
|
||||
Operating Environment
|
* Operating Temperature:10°C ~ 35°C (50°F ~ 95°F)
* Non-operating Temperature:-40°C to 60°C (-40°F to 140°F) * Operating Relative Humidity:8% to 90% (non-condensing) * Non-operating Relative Humidity:5% to 95% (non-condensing) |
|
|
|