Seq
|
Item
|
capability
|
1
|
Base Material
|
FR-4, High TG FR-4 , Halogen Free material ,CEM-3,CEM-1,PTFE,Rogers ,Arlon ,Taconic,Aluminum base,PI ,etc
|
2
|
Layers
|
1-40 ( ≥30 layers needs review )
|
3
|
Finished inner/outer copper thickness
|
0.5-6OZ
|
4
|
Finished board thickness
|
0.2-7.0mm(≤0.2mm needs review),≤0.4mm for HASL
|
|
|
Board thickness≤1.0mm: +/-0.1mm
1Board thickness>2.0mm: +/-8% |
5
|
Max panel size
|
≤2sidesPCB: 600*1500mm
Multilayer PCB: 500*1200mm |
6
|
Min conductor line width/spacing
|
Inner layers: ≥3/3mil
Outer layers: ≥3.5/3.5mil |
7
|
Min hole size
|
Mechanical hole: 0.15mm
Laser hole: 0.1mm |
|
|
Drilling precision: first drilling First drilling: 1mil
Second drilling: 4mil |
8
|
Warpage
|
Board thickness≤0.79mm: β≤1.0%
0.80≤Board thickness≤2.4mm: β≤0.7% Board thickness≥2.5mm: β≤0.5% |
9
|
Controlled Impedance
|
+/- 5 % Ω(<50Ω),+/-10%(≥50Ω),≥50Ω+/-5% (needs review)
|
10
|
Aspect Ratio
|
15:01
|
11
|
Min welding ring
|
4mil
|
12
|
Min solder bridge
|
≥0.08mm
|
13
|
Plugging vias capability
|
0.2-0.8mm
|
14
|
Hole tolerance
|
PTH: +/-3mil
NPTH: +/-2mil |
15
|
Outline profile
|
Rout/ V-cut/ Bridge/ Stamp hole
|
16
|
Solder color
|
Green,yellow,black,blue,red,white,matte green
|
17
|
Component mark color
|
white,yellow,black
|
18
|
Surface treatment
|
OSP: 0.2-0.5um
HASL: 2-40um Lead free HASL: 2-40um ENIG: Au 1-10U’’ ENEPIG: PB 2-5U’’/ Au 1-8U’’ Immersion Tin:0.8-1.5um Immersion silver: 0.1-1.2um Peelable blue Carbon ink Gold plating: Au 1-150U’’ |
19
|
E-Test
|
Flying probe tester : 0.4-6.0mm,max 19.6*23.5inch
|
|
|
Min spacing from test pad to board edge : 0.5 mm
|
|
|
Min conductive resistance : 5 Ω
|
|
|
Max insulation resistance : 250 MΩ
|
|
|
Max test voltage : 500 V
|
|
|
Min test pad diameter : 6 mil
|
|
|
Min test pad to pad spacing : 10 mil
|
|
|
Max test current : 200 MA
|
20
|
AOI
|
Orbotech SK-75 AOI : 0.05-6.0mm,max 23.5*23.5inch
|
|
|
Orbotech Ves machine : 0.05-6.0mm,max 23.5*23.5inch
|